Copper-containing anti-biofilm nanofiber scaffolds as a wound dressing material

Simple item page
dc.contributor.authorAhire, Jayesh J.en_ZA
dc.contributor.authorHattingh, Melanieen_ZA
dc.contributor.authorNeveling, Deon P.en_ZA
dc.contributor.authorDicks, Leon Milner Theodore, 1961-en_ZA
dc.date.accessioned2017-10-11T14:09:06Z
dc.date.available2017-10-11T14:09:06Z
dc.date.issued2016
dc.descriptionCITATION: Ahire, J. J., et al. 2016. Copper-containing anti-biofilm nanofiber scaffolds as a wound dressing material. PLoS ONE, 11(3):e0152755, doi:10.1371/journal.pone.0152755.
dc.descriptionThe original publication is available at http://journals.plos.org/plosone
dc.description.abstractCopper particles were incorporated into nanofibers during the electrospinning of poly-D,L-lactide (PDLLA) and poly(ethylene oxide) (PEO). The ability of the nanofibers to prevent Pseudomonas aeruginosa PA01 and Staphylococcus aureus (strain Xen 30) to form biofilms was tested. Nanofibers containing copper particles (Cu-F) were thinner (326 ± 149 nm in diameter), compared to nanofibers without copper (CF; 445 ± 93 nm in diameter). The crystalline structure of the copper particles in Cu-F was confirmed by X-ray diffraction (XRD). Copper crystals were encapsulated, but also attached to the surface of Cu-F, as shown scanning transmission electron microscopy (STEM) and transmission electron microscopy (TEM), respectively. The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC). After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively. Reduction in biofilm formation was ascribed to copper released from the nanofibers. Copper-containing nanofibers may be incorporated into wound dressings.en_ZA
dc.description.urihttp://journals.plos.org/plosone/article?id=10.1371/journal.pone.0152755
dc.description.versionPublisher's version
dc.format.extent12 pages ; illustrations
dc.identifier.citationAhire, J. J., et al. 2016. Copper-containing anti-biofilm nanofiber scaffolds as a wound dressing material. PLoS ONE, 11(3):e0152755, doi:10.1371/journal.pone.0152755
dc.identifier.issn1932-6203 (online)
dc.identifier.otherdoi:10.1371/journal.pone.0152755
dc.identifier.urihttp://hdl.handle.net/10019.1/102311
dc.language.isoen_ZAen_ZA
dc.publisherPublic Library of Science
dc.rights.holderAuthors retain copyright
dc.subjectWound dressings -- Materialsen_ZA
dc.subjectBandages and bandaging -- Materialsen_ZA
dc.subjectCopper -- Therapeutic useen_ZA
dc.subjectNanofibersen_ZA
dc.subjectBiofilmsen_ZA
dc.titleCopper-containing anti-biofilm nanofiber scaffolds as a wound dressing materialen_ZA
dc.typeArticleen_ZA
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
ahire_copper_2016.pdf
Size:
659.73 KB
Format:
Adobe Portable Document Format
Description:
Download article
Download
License bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
license.txt
Size:
1.95 KB
Format:
Item-specific license agreed upon to submission
Description:
Download
Collections
Research Articles (Microbiology)